大会主要涉及半导体封装技术、设计和材料等内容。由中国电子学会及 IEEE-CPMT (USA)、IMAPS (USA)、JIEP (Japan)、IME (Singapore)等组织联合举办。
文章涉及领域包括：
  Overview on advanced electronic packaging technologies;
  Packaging design, modeling and simulation;
  Manufacturing technologies;
  Packaging materials and components;
  Packaging processes: wiring, attaching, bonding, soldering and encapsulation;
  Material & process characterization
  Reliability and testing;
  Interconnecting technologies;
  MEMS;
  SMT
  Industry and marketing.
  http://www.icept2003.org